HSB09-212115

Produttore :

CUI Devices

categoria di prodotto :

Termico - Dissipatori di calore

Attachment Method :

Adhesive

Diameter :

-

Fin Height :

0.591" (15.00mm)

Length :

0.827" (21.00mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

4.3W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

6.00°C/W @ 200 LFM

Thermal Resistance @ Natural :

17.39°C/W

Type :

Top Mount

Width :

0.827" (21.00mm)