BDN18-3CB/A01

Numero di parte del produttore
BDN18-3CB/A01
Produttore
CTS Thermal Management Products
Pacchetto/scatola
-
Scheda dati
Scarica
Descrizione
HEATSINK CPU W/ADHESIVE 1.81"SQ
Azione:
Disponibile

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Produttore :
CTS Thermal Management Products
categoria di prodotto :
Termico - Dissipatori di calore
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Fin Height :
0.355" (9.02mm)
Length :
1.810" (45.97mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
3.50°C/W @ 400 LFM
Thermal Resistance @ Natural :
10.80°C/W
Type :
Top Mount
Width :
1.810" (45.97mm)
Schede tecniche
BDN18-3CB/A01

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