- Produttore :
- 3M
- categoria di prodotto :
- Prese per circuiti integrati, transistor
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 30.0µin (0.76µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- -
- Housing Material :
- Polyethersulfone (PES)
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 625 (25 x 25)
- Operating Temperature :
- -55°C ~ 150°C
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Last Time Buy
- Termination :
- Solder
- Type :
- PGA, ZIF (ZIP)
- Schede tecniche
- 200-6325-9UN-1900
