- Material：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
6 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
181
In-stock
|
Ottieni preventivo | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
20
In-stock
|
Ottieni preventivo | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 457.2MMX4... |
1 |
50,000
In-stock
|
Ottieni preventivo |
