- Produttore：
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- Product Status：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
3,885
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
137
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PI... |
1 |
2,379
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK PWR 1.0"H... |
1 |
50,000
In-stock
|
Ottieni preventivo |
