- Produttore：
-
- CUI Devices (2)
- Material：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
7 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
TE Connectivity AMP Connectors | 32.5MM HS ASSY ULTE |
1 |
50,000
In-stock
|
Ottieni preventivo |
