- Produttore:
-
- CUI Devices (2)
- Wakefield-Vette (1)
- Material:
-
- Type:
-
- Width:
-
- Length:
-
- Attachment Method:
-
- Package Cooled:
-
- Fin Height:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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11 Record
Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
---|---|---|---|---|---|---|---|
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Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | HEAT SINK 33MM X 33... |
1 |
54
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-3 |
1 |
2,419
In-stock
|
Ottieni preventivo | ||
![]() |
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | HEAT SINK 40MM X 40... |
1 |
108
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | MAXIGRIP FANSINK... |
1 |
349
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
273
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK 40X40X24.5M... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
CUI Devices | HEAT SINK, BGA, 60 ... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
Ottieni preventivo |