- Produttore：
-
- CUI Devices (1)
- Material：
-
- Type：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
11 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK BLK ALU... |
1 |
1,263
In-stock
|
Ottieni preventivo | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-126 BL... |
1 |
6,060
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
349
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK LOW-PRO... |
1 |
30,061
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK LOW-PRO... |
1 |
276
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK LOW-PRO... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
3,746
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
10
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
12
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEATSINK TO-220 6.5W... |
1 |
50,000
In-stock
|
Ottieni preventivo |
