- Produttore：
-
- CUI Devices (3)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
9 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,247
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,249
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
532
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | FINGER-SHAPED-HE... |
1 |
50,000
In-stock
|
Ottieni preventivo |
