- Produttore：
-
- CUI Devices (2)
- Wakefield-Vette (3)
- Material：
-
- Width：
-
- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
56,661
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
5,930
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | ALUMINIUM HEAT S... |
1 |
143
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1 |
1,280
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
1 |
13
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK ASSY FO... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK ASSY FO... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATINK ASSY FOR... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
1 |
50,000
In-stock
|
Ottieni preventivo |
