- Produttore：
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- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc | CLIP-ON H/S FOR 14/... |
1 |
266
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK 14-16 DIP ... |
1 |
1,512
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo |
