- Produttore：
-
- Wakefield-Vette (10)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
11 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc | HEATSINK FOR TO-2... |
1 |
1,448
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo |
