- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
- Material Finish：
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5 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | 3WX36" EXTRUSION 90... |
1 |
14
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | 3WX12" EXTRUSION 90... |
1 |
105
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK COMPACT |
1 |
50,000
In-stock
|
Ottieni preventivo |
