- Produttore：
-
- Attachment Method：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
-
4 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
7,693
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CTS Thermal Management Products | HEATSINK LOW-PRO... |
1 |
50,000
In-stock
|
Ottieni preventivo |
