- Produttore：
-
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Width：
-
- Length：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 W/T... |
1 |
103
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK 1.75" HIG... |
1 |
8,283
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK 1.75" HIG... |
1 |
1,303
In-stock
|
Ottieni preventivo | ||
|
|
NTE Electronics, Inc | HEAT SINK FOR TO2... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 CO... |
1 |
402
In-stock
|
Ottieni preventivo | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 HI... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
1 |
50,000
In-stock
|
Ottieni preventivo |
