- Produttore：
-
- Comair Rotron (1)
- Material：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
10 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
1 |
25
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
76
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
32
In-stock
|
Ottieni preventivo | ||
|
|
Comair Rotron | HEATSINK STAMP 20... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
98
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
20
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
67
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
1 |
50,000
In-stock
|
Ottieni preventivo |
