- Produttore：
-
- CUI Devices (1)
- Wakefield-Vette (1)
- Material：
-
- Length：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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9 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
9,429
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK COPPER ... |
1 |
1,579
In-stock
|
Ottieni preventivo | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
179
In-stock
|
Ottieni preventivo | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 W/T... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
4,717
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 BLA... |
1 |
3,127
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
228
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
Ottieni preventivo |
