- Produttore：
-
- Ohmite (1)
- Wakefield-Vette (1)
- Material：
-
- Type：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
10 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,535
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,544
In-stock
|
Ottieni preventivo | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,143
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 H31.7... |
1 |
559
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
8
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEATSINK POWER T... |
1 |
499
In-stock
|
Ottieni preventivo | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
273
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo |
