- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TI... |
1 |
7,151
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TI... |
1 |
5,612
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
4,425
In-stock
|
Ottieni preventivo |
