- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Material Finish:
-
4 Record
Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
---|---|---|---|---|---|---|---|
![]() |
Wakefield-Vette | HEATSINK ASSY FO... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
Wakefield-Vette | HEATSINK ASSY FO... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
Wakefield-Vette | HEATSINK ASSY FO... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
Wakefield-Vette | HEATINK ASSY FOR... |
1 |
50,000
In-stock
|
Ottieni preventivo |