- Produttore：
-
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | PH3N NANO 76.2X19.1X0... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | PH3N NANO 76.2X19.1X0... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
t-Global Technology | PH3 76.2X19.1X0.21MM |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo |
