- Produttore：
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- CUI Devices (1)
- Material：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
1,647
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
1,498
In-stock
|
Ottieni preventivo | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
35,105
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | 61565 EXTRUSION 0.19X... |
1 |
19
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK 14-DIP/16-... |
1 |
1,427
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
52
In-stock
|
Ottieni preventivo |
