- Produttore:
-
- CUI Devices (4)
- Wakefield-Vette (2)
- Material:
-
- Length:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
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11 Record
Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions Inc. | HEATSINK AL6063 300X... |
1 |
307
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-220 |
1 |
786
In-stock
|
Ottieni preventivo | ||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
791
In-stock
|
Ottieni preventivo | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1 |
710
In-stock
|
Ottieni preventivo | ||
![]() |
Wakefield-Vette | COPPER HEATSINK ... |
1 |
39
In-stock
|
Ottieni preventivo | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
![]() |
Wakefield-Vette | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Ottieni preventivo |