- Produttore：
-
- Wakefield-Vette (8)
- Attachment Method：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
10 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
84
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
4,137
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Ottieni preventivo |
