- Produttore：
-
- Comair Rotron (1)
- CUI Devices (1)
- Ohmite (8)
- Wakefield-Vette (2)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
19 Record
| Immagine | Parte | Produttore | Descrizione | MOQ | Azione | Azione | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
5,682
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
820
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1 |
681
In-stock
|
Ottieni preventivo | ||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1 |
146
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
53
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
50,000
In-stock
|
Ottieni preventivo | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-202 CL... |
1 |
50,000
In-stock
|
Ottieni preventivo |
